Infineon invests €1.1 billion in new GaN wafer facility
The Villach site expands European manufacturing capacity with €319 million Chips Act funding to produce next-gen power semiconductors by 2027.
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Semiconductor and system solutions company
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In short: Infineon planned a €1.1 billion Austrian GaN expansion and advanced AI data-center power partnerships
The Villach site expands European manufacturing capacity with €319 million Chips Act funding to produce next-gen power semiconductors by 2027.
Winbond acquires the division in an all-cash deal closing in late 2027, allowing Infineon to focus on core growth areas while retaining specialty memory solutions.
The deal strengthens Infineon’s global R&D footprint in India and accelerates software-defined power architectures for next-generation AI infrastructure by closing in Q3 2026.
Q3 revenue is €4.2bn at a 19.1% segment result margin. It forecasts ~€16.3bn annual revenue and over €1.6bn in AI data-center revenue.
Infineon Austria builds first high-volume factory for 300-mm GaN power semiconductors, with help from EU subsidies.
Infineon Technologies AG will spend €1.1 billion ($1.2 billion) over eight years to expand its key power chip factory in Austria, a bet on growing...
Infineon has partnered with Nvidia to develop gallium nitride (GaN) power conversion technology for 800 VDC data center architectures. The German chipmaker announced the tie-up...
The District Court Munich ruled in favor of Infineon Technologies in two further patent infringement cases against Innoscience concerning gallium nitride (GaN) technology on June...
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