MediaTek and Samsung achieve 3Tx 5-layer uplink breakthrough
The joint test delivered 670 Mbps uplink throughput, enhancing FWA performance.
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Semiconductor solutions for smart devices
mediatek.comLast updated
In short: MediaTek expanded its AI and connectivity portfolio at COMPUTEX 2026, showcasing high-performance chips, Wi-Fi 8 tech, and automotive solutions.
The joint test delivered 670 Mbps uplink throughput, enhancing FWA performance.
The joint chip fuses MediaTek's CPU expertise with NVIDIA's AI platform to power efficient Windows 11 PCs with local AI agents and gaming.
The world’s first 5G-Advanced NR-NTN LEO satellite connection was shown using a next-generation modem.
The booth will highlight Wi-Fi 8, 6G, NVIDIA DGX Spark, and advanced data center solutions.
MediaTek has confirmed that Nvidia’s RTX Spark platform will include cheaper processor variants, expanding the lineup beyond the previously detailed high-end configuration.
A rumor claims that Qualcomm’s efforts have paid off, with the standard SoC expected to be offered a...
MediaTek and NVIDIA jointly demonstrated at the exhibition the Agentic AI supercomputer NVIDIA DGX Spark equipped with the NVIDIA GB10 Grace Blackwell superchip, featuring a 1 petaFLOP GPU, 20-core CPU, and LPDDR5x unified architecture memory, which can directly run large AI models on the terminal and perform various tasks through an automatic coordination mechanism. In addition, the exhibition also showcased the...
The company, which expects its AI accelerator ASIC business to generate billions of dollars in revenue by 2027, sees India ...
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