Smiths Interconnect to be sold to Molex for £1.3bn
The deal values the business at 15.1x EBITDA and is expected to close in H2 2026.
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High-reliability connectivity products and solutions provider
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In short: Smiths Interconnect agreed to a £1.3bn sale to Molex, secured an exclusive AI chip test contract, and appointed Vera Parker as President.
The deal values the business at 15.1x EBITDA and is expected to close in H2 2026.
The contract is with a major AI semiconductor provider for their next-generation chips. The DaVinci Gen V sockets will be used in manufacturing test.
She succeeds Julian Fagge, who becomes CFO of Smiths Group. Vera brings experience from Smiths Group, Rio Tinto, and Schlumberger.
The process reduces production time, waste, and cost while enabling local manufacturing in Scotland.
Smiths Group said on Thursday it will sell its interconnect unit to U.S. electronic components maker Molex Electronic in a deal valued at 1.3 billion...
Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its...
Smiths Interconnect has extended its high density modular and mini-modular connectors ranges with the addition of two new types of data transmission modules. Cat5e and...
Smiths Interconnect has received £1,907,065 in funding from the UK Space Agency through its ‘Space Clusters Infrastructure Fund’ (SCIF). The funding will be used to...
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