Molex unveils multi-channel liquid cooled busbar at Computex 2026
It embeds seven coolant paths into the power-distribution layer to boost cooling efficiency by up to 20% over single-channel designs.
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Global manufacturer of electronic components and interconnect solutions
molex.comLast updated
In short: Molex expanded its AI data center and optical connectivity portfolios through strategic acquisitions and high-performance product launches.
It embeds seven coolant paths into the power-distribution layer to boost cooling efficiency by up to 20% over single-channel designs.
Teramount's detachable fiber-to-chip technology enables high-volume Co-Packaged Optics for AI.
Teramount provides detachable fiber-to-chip connectivity for co-packaged optics, aiming to accelerate scalable CPO adoption for AI and data centers.
Expands portfolio with ruggedized connectors, RF components, and semiconductor test capabilities, strengthening global footprint.
Molex Teramount deal adds detachable fibre-to-chip coupling for co-packaged optics in AI and hyperscale data centres worldwide.
LISLE, Ill.--(BUSINESS WIRE)--Molex Electronic Technologies, LLC today announced it has completed the acquisition of the Connected Vehicle Solutions ("CVS") division of Laird Limited, owned by...
Credo Technology Group Holding resolved separate legal disputes with TE Connectivity Corporation and...
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