Amkor expands advanced packaging and test capacity
The company is adding capacity in Arizona and Korea to meet demand for AI and high-performance computing.
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World's largest US-based semiconductor packaging & test services provider
amkor.comLast updated
In short: Amkor Technology expanded its U.S. footprint and entered a 10-year partnership with TSMC to strengthen semiconductor supply chains.
The company is adding capacity in Arizona and Korea to meet demand for AI and high-performance computing.
The award was part of Arizona's sixth consecutive Gold Shovel Award for attracting major investments and job creation.
The agreement commits both companies to expand advanced packaging and testing capacity in Arizona over ten years, strengthening the U.S. semiconductor supply chain.
The event provided updates on advanced packaging, global manufacturing expansion, and strategic priorities for long-term growth.
Government pledges infrastructure, advanced city development and signs MOU with firms SK Group, Samsung Electronics and Amkor Technology will invest a combined 896 trillion won...
TSMC (NYSE:TSM) has entered a 10 year partnership with Amkor Technology to expand advanced semiconductor packaging and testing capacity in Arizona. The collaboration focuses on...
Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong partnership that will enhance...
Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and ...
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