ASE Holdings launches 310mm panel-level packaging automation production line
Expected to start mass production in the first half of 2027, supporting FOCoS and FOCoS-Bridge platforms, enhancing AI computing performance.
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Semiconductor packaging and testing service provider
aseglobal.comLast updated
In short: ASE Holdings expanded its global AI packaging capacity through new facility investments, strategic partnerships, and record employee compensation.
Expected to start mass production in the first half of 2027, supporting FOCoS and FOCoS-Bridge platforms, enhancing AI computing performance.
The partnership focuses on scaling Elevated Fanout Bridge technology for high-volume AI applications.
The facility will focus on FOCoS and FC BGA technologies for AI and HPC applications, incorporating smart and green manufacturing.
The new factory will be operational in 2029, expected to create about 2,050 job opportunities, and introduce AI advanced packaging technology.
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