ASE Holdings launches 310mm panel-level packaging automation production line
Expected to start mass production in the first half of 2027, supporting FOCoS and FOCoS-Bridge platforms, enhancing AI computing performance.
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Semiconductor packaging and testing service provider
aseglobal.comLast updated
In short: ASE Holdings expanded its AI-driven semiconductor leadership through record capital investments and strong double-digit revenue growth.
Expected to start mass production in the first half of 2027, supporting FOCoS and FOCoS-Bridge platforms, enhancing AI computing performance.
The partnership focuses on scaling Elevated Fanout Bridge technology for high-volume AI applications.
The facility will focus on FOCoS and FC BGA technologies for AI and HPC applications, incorporating smart and green manufacturing.
The new factory will be operational in 2029, expected to create about 2,050 job opportunities, and introduce AI advanced packaging technology.
TAIPEI, Aug. 10, 2026 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues...
By Wen-Yee Lee TAIPEI, July 30 (Reuters) - Taiwan's ASE Technology Holding, the world's largest chip packaging and testing provider, said on Thursday it would...
ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. It develops and offers complete turnkey solutions in IC (Integrated Circuit) packaging...
ASE Technology June revenue jumped 32.9% YoY; Q2 up 26.7% with strong ATM assembly/testing growth.
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