Passat picosecond lasers drill high-aspect-ratio micro-holes through thick materials
A 6-ps, 266-nm UV laser with 30 micro-Joules per pulse drills 10-micron holes through 1.8-mm Cu-clad Teflon in 2 minutes. No special techniques used.
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Manufacturer of diode-pumped solid-state lasers
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A 6-ps, 266-nm UV laser with 30 micro-Joules per pulse drills 10-micron holes through 1.8-mm Cu-clad Teflon in 2 minutes. No special techniques used.
It showcases high-aspect ratio drilling in dielectrics and speed of Compiler HPRR picosecond lasers. Images and video provide details.
The laser offers peak powers from 250 MW at 1064 nm to 10 MW at 213 nm for applications like wafer cutting and micromachining.
The 14-kHz picosecond DPSS laser drills metal strips, with time proportional to depth. It suits wafer cutting, micromachining, and scribing.
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