Ligent Releases Next-Generation 12.8T XPO Optical Module Product
The module adopts a linear pluggable architecture and thin-film lithium niobate technology, with power consumption below 80W, supporting high-speed interconnection in AI data centers.
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Full-stack provider of optical communication and interconnect solutions
ligent.com.cnLast updated
In short: Ligent consolidated Hisense operations and launched an $800 million initial public offering in Hong Kong to support its optical AI growth.
The module adopts a linear pluggable architecture and thin-film lithium niobate technology, with power consumption below 80W, supporting high-speed interconnection in AI data centers.
The product uses silicon photonics technology to optimize bandwidth and power consumption, reducing per-bit power consumption by approximately 50 percent, supporting single-layer 512-card AI all-optical interconnection, and will be officially unveiled at the CIOE exhibition.
The exhibition showcases NPO/XPO modules, high-power external light sources, and liquid-cooled pluggable solutions, covering speeds from 1.6T to 12.8T, and previews industry technology forum sharing.
The product matrix covers 1.6T LPO, 3.2T NPO and 400G/lane technologies, targeting AI data center interconnection, participating in OIF interoperability demonstrations.
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Chinese optical communication and optical connection product supplier Ligent Technologies has passed the HKEX listing hearing and is reportedly conducting a pre-IPO roadshow to raise US$800 million (approximately HK$6.24 billion). Earlier, Ligent Technologies received approval from the China Securities Regulatory Commission for its plan to list in Hong Kong. According to the filing notice issued by the CSRC, Ligent Technologies plans to issue no more than 310 million ordinary shares for overseas listing and list in Hong Kong. Citigroup and CITIC Securities are the sponsors...
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