Extropic signs $75M CHIPS letter with US Commerce Department
Planned CHIPS R&D funding to scale thermodynamic sampling units for AI workloads and fabricate at American foundry.
See the latest news and media coverage for Extropic. We track all announcements, press releases, and industry mentions in real time, all in one place.
Thermodynamic computing hardware developer
extropic.aiLast updated
In short: Extropic emerged from stealth and released its first thermodynamic chips designed to run generative AI with massive energy efficiency.
Planned CHIPS R&D funding to scale thermodynamic sampling units for AI workloads and fabricate at American foundry.
The new paper and THRML code show hardware-grounded estimates of energy savings over GPUs for this pharma workload.
TSU is a thermodynamic sampling unit for energy-efficient generative AI using probabilistic computing and Gibbs sampling. Z1 chip features hundreds of thousands of cells.
XTR-0 enables ultra-efficient AI algorithm development using X0 chips with probabilistic TSUs. Ships limited units to researchers. Upgradable to future chips.
CHIPS Act semiconductor funding reached $874 million July 29 as the Commerce Department signed letters of intent with seven companies targeting AI hardware chokepoints: ferroelectric...
Extropic, the American company pioneering thermodynamic computing hardware, today announced the signing of a letter of intent with the U.S. Department of Commerce for up...
Normal Computing is part of a growing group of startups exploring alternatives to conventional AI hardware, including Unconventional AI, led by former Intel AI chief...
Can thermal noise become computing fuel for AGI, Inside Extropic's P-bit chips, early tests hint at efficiency gains but algorithms must catch up.
Track Extropic and your other target companies to get real-time alerts and weekly summaries delivered straight to your inbox.
Browse news for competitors to Extropic and other trending companies.