Latest Black Semiconductor News & Updates
See the latest news and media coverage for Black Semiconductor. We track all announcements, press releases, and industry mentions in real time, all in one place.
Integrated graphene photonics platform
blacksemi.com- Headquarters
- Aachen, Germany
- Founded year
- 2020
- Company type
- Public company
- Number of employees
- 125–200
Latest news about Black Semiconductor
Company announcements
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Black Semiconductor relocates team from FabONE
They focus on pilot line construction and partner with Exyte on a pioneering 300mm graphene fab integrating electronics and photonics.
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Black Semiconductor begins FabONE construction
The facility will be the world's first 300mm 2D material semiconductor plant integrating electronics and photonics using graphene to solve chip communication limits. Timeline: construction H1 2026, pilot production 2027.
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Black Semiconductor builds world's first fab integrating photonics and electronics
They reference a BCG report emphasizing translation from lab to fab for competitiveness in microelectronics.
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Black Semiconductor signs Exyte to build FabONE
They start cleanroom and infrastructure construction for a 300mm graphene photonics pilot fab, with equipment due in 2026.
Media coverage
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Black Semiconductor chooses Critical Manufacturing for the fully automated 300-mm pilot line in Aachen, Germany
Critical Manufacturing, a leading provider of Manufacturing Operations Platform and key driver of Industry 4.0, has been selected by Black...
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Germany's Nvidia? Chipmaker from Magdeburg gets 100 million euros
Semiconductors are considered a 'strategic key technology'. Now VCs and the federal government have invested 100 million in the chip manufacturer FMC.
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Black Semiconductor Raises $275 Million | Industry News | Aug 2024
Black Semiconductor Raises $275 Million ... Graphene chip developer Black Semiconductor has raised €254.4 million (~$275.4 million) in funding. The startup is...
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Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
Silicon Box is another semiconductor packaging upstart featured in the Silicon 100 report; it specializes in the production of multi-die components based on chiplet architecture...
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