AT&S announces early repayment of the 2022 hybrid bond
The company is refinancing the debt instrument via the 2026 hybrid convertible bond, thereby significantly reducing its ongoing financing costs.
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Manufacturer of high-end printed circuit boards and IC substrates
ats.netLast updated
In short: AT&S posted 40% revenue growth in Q1, raised its AI substrate outlook and refinanced its hybrid bond
The company is refinancing the debt instrument via the 2026 hybrid convertible bond, thereby significantly reducing its ongoing financing costs.
Long-term agreement secures capacity expansion for IC substrates in Malaysia to support AI infrastructure demand.
Revenue rises 40% to €549m while EBITDA margin reaches 30.1%. The company confirms full-year guidance and expands manufacturing in Kulim and Chongqing.
Auditor Deloitte appointed, all agenda items approved.
EQS News: AT&S Austria Technologie & Systemtechnik AG / Keywords: Agreement AT&S and Marvell Technology expand collaboration on next-generation AI infrastructure...
AT&S Austria Technologie & Systemtechnik AG increased revenue by 38% to EUR 549 million in the first quarter of 2026/27. On a currency-adjusted basis, growth was...
In Q1 2026/27, the company delivered a powerful performance: strong top-line growth, sharply higher profitability, and a successful hybrid convertible bond issue underpin its ambitious...
The issuer / publisher is responsible for the content of the announcement. AT&S expands Kulim site to support long-term customer demand and strategic technology partnerships...
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