Latest EV Group News & Updates

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EV Group (EVG)

Semiconductor manufacturing equipment supplier

evgroup.com

Headquarters: St. Florian am Inn, Austria
Founded year: 1980
Company type: Private company
Number of employees: 1,000–5,000
Industry: Semiconductor Equipment & Testing

Last updated Today

Latest news about EV Group (EVG)

In short: EVG secured its 14th consecutive customer satisfaction award and demonstrated advanced wafer-to-wafer hybrid bonding with imec.

Company announcements

July 21 EVG

EVG tops customer rankings with fourteenth consecutive Triple Crown

EVG won the Global Semiconductor Supplier Award in the TechInsights 2026 Customer Satisfaction Survey for the fourteenth time.

June 16 EVG

EVG hosts 14AMI project consortia meeting

Around 30 international experts gather to develop next-gen solutions for the 14-Ångström CMOS node, including CFET integration and metrology.

June 2 EVG

EVG partners with SAL on quantum tech

The MoU with Silicon Austria Labs aims to scale quantum and semiconductor technologies.

May 28 EVG

EVG and imec demonstrate 200nm-pitch wafer-to-wafer hybrid bonding

The technology achieves record-high overlay accuracy below 40nm, enabling advanced logic-to-logic and memory-to-logic tier stacking for CMOS 2.0 scaling.

Media coverage

May 28 Yahoo Finance

Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy

Through their continued collaboration, Imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking. Imec...

May 5 Stock Titan

Xanadu, EVG partner on photonic quantum chip production | XNDU Stock News

The company also leads the development of PennyLane, an open-source software library for quantum computing and application development. Visit xanadu.ai or follow us on X...

February 18 Morningstar

EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing

New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG®150-class performance in a smaller-scale, highly flexible format ST. FLORIAN, Austria, Feb. 18...

8 September 2025 Yahoo Finance

EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

New EVG ® 40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark...

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