Latest EV Group News & Updates

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EV Group (EVG)

Semiconductor manufacturing equipment supplier

evgroup.com

Headquarters: St. Florian am Inn, Austria
Founded year: 1980
Company type: Private company
Number of employees: 1,000–5,000
Industry: Semiconductor Equipment & Testing

Last updated September 15

Latest news about EV Group (EVG)

In short: EVG advanced hybrid bonding, expanded quantum partnerships, and won a 14th customer satisfaction award.

Company announcements

September 15 EVG

EVG demonstrates AR manufacturing feasibility with NTT-AT resin

The companies validated SmartNIL compatibility for high-refractive-index resins, enabling precise, durable waveguide production for augmented reality devices.

September 8 EVG

EVG and NTT-AT demonstrate high refractive index resin compatibility for AR waveguides

The partnership verified SmartNIL® process performance with NH762 resin, achieving high pattern fidelity and environmental resistance. Results will be presented at CIOE 2026.

June 2 EVG

EVG partners with SAL on quantum tech

The MoU with Silicon Austria Labs aims to scale quantum and semiconductor technologies.

May 28 EVG

EVG and imec demonstrate 200nm-pitch wafer-to-wafer hybrid bonding

The technology achieves record-high overlay accuracy below 40nm, enabling advanced logic-to-logic and memory-to-logic tier stacking for CMOS 2.0 scaling.

Media coverage

May 28 ELEKTRONIKPRAXIS

Imec and EVG demonstrate high-precision hybrid bonding with 200-nm pitch

Imec and EV Group have presented at the IEEE Electronic Components and Technology Conference 2026 a wafer-to-wafer hybrid bonding technology with a pad pitch of 200 nm for copper interconnects...

May 5 Stock Titan

Xanadu, EVG partner on photonic quantum chip production | XNDU Stock News

The company also leads the development of PennyLane, an open-source software library for quantum computing and application development. Visit xanadu.ai or follow us on X...

February 18 Yahoo Finance

EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing

New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG ® 150-class performance in a smaller-scale, highly flexible format ST. FLORIAN, Austria...

September 8, 2025 Yahoo Finance

EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

New EVG ® 40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark...

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