Latest EV Group News & Updates

See the latest news and media coverage for EVG. We track all announcements, press releases, and industry mentions in real time, all in one place.

EV Group (EVG)

Semiconductor manufacturing equipment supplier

evgroup.com

Headquarters: St. Florian am Inn, Austria
Founded year: 1980
Company type: Private company
Number of employees: 1,000–5,000

Last updated Today

Latest news about EV Group (EVG)

In short: EVG advanced semiconductor bonding technology and expanded its manufacturing and support footprint globally.

Company announcements

May 28 EVG

EVG and imec demonstrate 200nm-pitch wafer-to-wafer hybrid bonding

The technology achieves record-high overlay accuracy below 40nm, enabling advanced logic-to-logic and memory-to-logic tier stacking for CMOS 2.0 scaling.

May 19 EVG

EVG to showcase hybrid bonding and lithography at ECTC 2026

The company will present its GEMINI FB, EVG40 D2W, IR LayerRelease, and LITHOSCALE XT systems for advanced packaging.

May 19 EVG

EVG tops TechInsights customer satisfaction survey for 14th consecutive year

It achieved Five Star ratings and first-place finishes in multiple equipment categories, including lithography and specialty fab equipment.

May 5 EVG

EVG partners with Xanadu to scale photonic quantum hardware

They will use EVG's bonding and lithography tools for heterogeneous integration of chips.

Media coverage

May 28 Yahoo Finance

Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy

Through their continued collaboration, Imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking. Imec...

May 5 Stock Titan

Xanadu, EVG partner on photonic quantum chip production | XNDU Stock News

The company also leads the development of PennyLane, an open-source software library for quantum computing and application development. Visit xanadu.ai or follow us on X...

February 18 Morningstar

EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing

New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG®150-class performance in a smaller-scale, highly flexible format ST. FLORIAN, Austria, Feb. 18...

8 September 2025 Yahoo Finance

EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

New EVG ® 40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark...

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