Besi announces early redemption of €175 million bonds
The €175 million 1.875% convertible bonds due 2029 are to be redeemed on 2026-06-04 at 100% and holders may convert until 2026-05-26. Conversion price is €115.50 per share.
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Developer and manufacturer of semiconductor assembly equipment
besi.comLast updated
In short: Besi reported spectacular growth driven by AI-related demand and hybrid bonding, while initiating bond redemptions and expanding into Vietnam.
The €175 million 1.875% convertible bonds due 2029 are to be redeemed on 2026-06-04 at 100% and holders may convert until 2026-05-26. Conversion price is €115.50 per share.
Highlights financial performance, AI-driven advanced packaging growth, hybrid bonding progress, and Q2-26 guidance.
All agenda items approved. Dividend of €1.58 per share for 2025 approved, payable from May 4, 2026.
Orders reach €269.7 million, up 104.5% vs. Q1-25. Revenue is €184.9 million, net income €51.6 million. Gross margin 63.5%.
BE Semiconductor Industries raised its long-term revenue and profitability targets, citing increased demand for AI-related products.
Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) reached a new 52-week high on Wednesday . The company traded as high as...
(ABM FN-Dow Jones) Bank of America on Tuesday raised the price target for BE Semiconductor Industries from 294 to 345 euros, with an unchanged buy recommendation. This...
Duiven, the Netherlands, May 19, 2026 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY) reports the following transactions, conducted...
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