Semiconductors & AI Chips Weekly Briefing
Samsung and SK Hynix kicked off HBM4 shipments; AMD hit major market share records; NVIDIA invested $53B in AI; and Applied Materials settled a major export probe, and more.
- Samsung and SK Hynix accelerated the HBM race, with Samsung starting commercial HBM4 shipments for NVIDIA s Rubin chips, while SK Hynix prepared to ship its own HBM4 and began ordering equipment for a new HBM packaging line. 123456
- SK Group executives strengthened strategic partnerships with major AI players including NVIDIA, Microsoft, Broadcom, and Meta, focusing on collaborations across HBM supply, AI data centers, and advanced accelerator roadmaps. 78910
- AMD demonstrated significant market share growth, surpassing 40% of server CPU revenue and over 35% in desktop PCs, and introduced new APIs and Solution Blueprints to support local AI development. 1112131415
- NVIDIA continued expanding its AI ecosystem, reportedly moving to acquire Groq s AI inference chip assets and investing heavily in AI startups, while partners confirmed up to 10x efficiency gains using the Blackwell platform. 16171819
- Applied Materials settled a US Commerce Department investigation for $252.5 million related to China export violations, even as the company announced Samsung would join its new multi-billion dollar EPIC R&D center in Silicon Valley. 20212223
- Cadence introduced ChipStack AI Super Agent to automate chip design and verification, and TSMC posted record January revenue while approving a 2026 capital expenditure plan of up to $56 billion. 242526272829
- Other notable developments included the U.S. ITC demanding confidential HBM data from SK Hynix regarding a Samsung patent probe, and Arm receiving a $71 million Texas grant for an Austin expansion. 303132
Sources
- SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race
- Samsung officially ships HBM4 ready for NVIDIA's next-gen Rubin AI chips
- Samsung Says It Starts Commercial Shipment of HBM4 to Customer
- Samsung ships industry-first commercial HBM4
- Samsung gains confidence with HBM4: "We will stay No. 1 in next-generation HBM as well"
- SK Hynix set to ship HBM4 for Nvidia's Vera Rubin this month
- SK Group Chairman meets NVIDIA CEO
- SK hynix discusses AI chip design with Broadcom
- SK Group expands AI partnership with Microsoft
- SK hynix discusses HBM supply and AI glasses with Meta
- AMD rockets past 35% market share in desktop PC market as Intel s share loss accelerates — AMD also hits 25% in laptops and nears 30% in crucial server market
- AMD Breaks Historic 40% Server Milestone as CPU Revenue Soars
- AMD partners with Liquid AI
- AMD introduces Solution Blueprints for AI deployment
- AMD introduces Lemonade API for local AI developers
- Nvidia Deepens AI Inference Push With Groq Deal And Rubin Platform
- AI inference costs dropped up to 10x on Nvidia's Blackwell — but hardware is only half the equation
- Partners cut AI inference costs up to 10x on Blackwell
- Nvidia's $53 Billion Investment Spree On AI Startups
- Applied Materials to Pay $252.5 Million to Settle US Probe
- Applied Materials Announces Samsung Electronics Will Join the New, Multibillion-Dollar EPIC Center in Silicon Valley
- Applied Materials reaches settlement with U.S. Department of Commerce
- Applied Materials announces Samsung joins EPIC Center
- Cadence unleashes ChipStack AI Super Agent, pioneering new frontier in chip design and verification
- Cadence launches ChipStack AI Super Agent
- Cadence ChipStack AI Super Agent Claims Up To 10X Faster Chip Design
- TSMC deepens its lead with a US$45 billion 2026 investment plan and a generational reshuffle
- TSMC Posts Record Monthly Revenue in January
- TSMC announces January 2026 revenue
- Arm receives Texas grant for Austin expansion
- U.S. ITC Seeks SK Hynix's Confidential HBM Data in Samsung Patent Probe
- Going Too Far: U.S. ITC Demands HBM Trade Secrets from SK Hynix
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